Ofrecemos diferentes tipos de sistemas de sobremesa y de ahorro de espacio (para uso en I+D, para prototipos y producción de pequeñas series)

RSO: Horno de soldadura por reflujo RSO-210 (hasta 650 °C)
RSS: Mini Sistema de Soldadura por Reflujo RSS-110-S, RSS-160-S, RSS-210-S (temp. máx. 400 °C)
RVS-210: Sistema de soldadura por reflujo en vacío hasta 400 °C también para fundente
VSS: Sistema de soldadura en vacío (hasta 400 °C) también para fundente

RSS-110-S

Mini Vacuum Reflow System with SIMATIC© control for substrate size up 100 x 100 mm

 

 

 

RSS-160-S

Mini Vacuum Reflow System with SIMATIC© control for substrate size up 160 x 160 mm

 

 

RSS-160-SC (Compact)

Mini Vacuum Reflow System with SIMATIC© control for substrate size up 160 mm x 160 mm

 

 

RSS 3X210-S

Vacuum Reflow System with SIMATIC© control for substrate size up to 3 x (200 x 200 mm) Lift pins for wafer lift up and down

 

RSS-210-S

Vacuum Reflow System with SIMATIC© control for substrate size up 200 x 200 mm

 

 

 

VSS-300

Vacuum Reflow Solder System for up to 300 x 300 mm substrate size

 

 

 

 

VSS-300-HV

VSS-300-HV Vacuum Solder System with high vacuum

 

 

 

VSS-450-300-OP

https://unitemp.de/EN/reflow-soldering/vss-series/vss-300/?id=312

 

 

 

VSS-OP

VSS with overpressure

 

 

 

2Z-HVS-100 2 zone high vacuum sealer with getter activation

customer specific adapters possible

2Z-HVS-200 2 zone high vacuum sealer with getter activation

customer specific adapters possible

 

 

 

 

 

RSO-210

Reflow Solder oven for substrate size up to 200 x 200 mm up to 650 °C

RSO-210-HV

High vacuum reflow solder oven for up to 200 x 200 mm substrate size up to 650 °C

 

 

RSO-300

RSO-300 for wafer size up to 300 mm

 

 

Para ampliar información info@irida.es