Ofrecemos diferentes tipos de sistemas de sobremesa y de ahorro de espacio (para uso en I+D, para prototipos y producción de pequeñas series)
RSO: Horno de soldadura por reflujo RSO-210 (hasta 650 °C)
RSS: Mini Sistema de Soldadura por Reflujo RSS-110-S, RSS-160-S, RSS-210-S (temp. máx. 400 °C)
RVS-210: Sistema de soldadura por reflujo en vacío hasta 400 °C también para fundente
VSS: Sistema de soldadura en vacío (hasta 400 °C) también para fundente
RSS-110-S
Mini Vacuum Reflow System with SIMATIC© control for substrate size up 100 x 100 mm
RSS-160-S
Mini Vacuum Reflow System with SIMATIC© control for substrate size up 160 x 160 mm
RSS-160-SC (Compact)
Mini Vacuum Reflow System with SIMATIC© control for substrate size up 160 mm x 160 mm
RSS 3X210-S
Vacuum Reflow System with SIMATIC© control for substrate size up to 3 x (200 x 200 mm) Lift pins for wafer lift up and down
RSS-210-S
Vacuum Reflow System with SIMATIC© control for substrate size up 200 x 200 mm
VSS-300
Vacuum Reflow Solder System for up to 300 x 300 mm substrate size
VSS-300-HV
VSS-300-HV Vacuum Solder System with high vacuum
VSS-450-300-OP
https://unitemp.de/EN/reflow-soldering/vss-series/vss-300/?id=312
VSS-OP
VSS with overpressure
2Z-HVS-100 2 zone high vacuum sealer with getter activation
customer specific adapters possible
2Z-HVS-200 2 zone high vacuum sealer with getter activation
customer specific adapters possible
RSO-210
Reflow Solder oven for substrate size up to 200 x 200 mm up to 650 °C
RSO-210-HV
High vacuum reflow solder oven for up to 200 x 200 mm substrate size up to 650 °C
RSO-300
RSO-300 for wafer size up to 300 mm
Para ampliar información info@irida.es
